DES生产线

Substrate specification (flex board)

500mmW*500mmL(max)

250mmW*250mmL(min)

0.012mm(core)+12/12µm Cu~1.2mm


Substrate specification (hard board)

600mmW*630mmL(max)

355mmW*355mmL(min)

0.025mm(core)+12/12µm Cu~3.2mm


Substrate specification (Backplane)

1050mmW*1100mmL(max)

355mmW*355mmL(min)

0.5mm~12mm

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