SES Process Line
Substrate specification (flex board)
500mmW*500mmL(max)
250mmW*250mmL(min)
0.012mm(core)+12/12µm Cu~1.2mm
Substrate specification (hard board)
600mmW*630mmL(max)
355mmW*355mmL(min)
0.025mm(core)+12/12µm Cu~3.2mm
Substrate specification (Backplane)
1050mmW*1100mmL(max)
355mmW*355mmL(min)
0.5mm~12mm